Feature(may vary by option.)
●Ultimate heat conductivity: with a thermal conductivity of 15W/mK, the GP Ultimate offers first-class performance.
●Easy to use: the GP Ultimate ensures easy use thanks to its thermal dimensions of 120 x 120 mm.
●Non-electric conductivity: the GP Ultimate is non-electrically conductive, non-corrosive, non-curing and non-toxic.
●PERFECT SIZES: GP ULTIMATE sizes are perfect for PCB surfaces, VGA cards, laptops, game consoles, microcontrollers, memory ICs and other SMD components.
●Thin: The GP Ultimate is available in various thicknesses of 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm and 3.0 mm.
[120x120x0.5]
[120x120x3.0]
[120x120x2.0]
[120x120x1.0]
Description
The GP-Ultimate 120×120 provides a perfect thermal interface for transferring heat to heat sink when placed on PCBs with height differences and uneven surfaces such as DRAM-ICs, VRM-ICs, performance MOSFETs, NVRAM ICs and other high temperature SMD components. duck installed. Thanks to its improved multi-layer matrix, superior material composition and ultimate thermal conductivity of 15W/mK, the GP-Ultimate 120×120 offers the best performance in its class. The GP-Ultimate 120×120 is non-electrically conductive, non-corrosive, non-hardening, non-toxic and supports an extended operating temperature range from -60°C to 220°C. It offers seamless application and has the dimensions of the thermal pad of 120 x 120 mm to optimally adapt enlarged surfaces of RAM memory modules, GPU and CPU VRM circuits, M.2 type SSDs and other tightly packed electronic devices.