Feature(may vary by option.)
●Premium material: heat-conducting silicone compound provides a thermal conductivity of 2.0 W / (m.k), which can effectively improve heat transfer between electronic components and heat sink and cool in seconds
●Practical assortment: the pack contains 30 pieces of 67 x 20 mm thermal pads. 6 pieces for each thickness: 0.5 / 1.0 / 1.5 / 2.0 / 3.0 mm. They can be cut, reused and overlapped
●Safety and stability: RoHS and PAH compliant. Working condition: -40 to 200 degrees Celsius. Hardness: 40 Shore Density: 2.4g/cm³ Breakdown Voltage: 5KV/mm They are anti-static, flame retardant, buffering, odourless, non-corrosive, non-irritating, adhesive but not harmful to electronics
●[Easy to use] Clean the heating surface. Measure and cut to size. Remove the protective film from the bottom of the thermal pad. Stick it to the surface, press lightly and then remove the protective film from the top. Install the heat sink and make good contact with the thermal pad. The thermal pads become more sticky when heated
●[Wide Application]: thermal pads are widely used in thermal management of electronics: desktop, laptop, game console, router, TV stick, drones, camera, hard drive, graphics card, NVMe SSD, power module and so on
[3 Dicke 0 | 5 | 1 | 1 | 5mm Pack of 30 thermal pads | 20 x 67 mm]
[5 Dicke 0 | 5 | 1 | 1 | 5 | 2 | 3mm Pack of 30 thermal pads | 20 x 67 mm]
Description
Why choose HASAYAKI thermal pads?
With HASAYAKI silicone thermal pads, you can instantly transfer heat from the heat source to the entire pad and then to the heatsink. The peak temperature drops by 5°C to 10°C within seconds when only thermal pads are used. With heat sink, the peak temperature can fall by 10°C to 30°C. HASAYKI thermal pads are soft for irregular surfaces, they are self-adhesive and can be easily removed without damaging the electronics. They are perfect for you to repair, tidy up, maintain and update your laptops, routers, graphics cards, drones, Playstations, NVMe SSDs, hard drives, setup boxes, DVDs, media players, etc.