Feature

●Heat-resistant up to 800°C.
●Optimal film properties after first heat stress. Does not chip or crack. Quick-drying
●Excellent adhesion, excellent covering and filling power. Conditional solvent resistance (temporary load) is applied after approx. 1 - 2 h reached at 200° C
●The optimum film properties and the full chemical and mechanical load capacity are maintained after the first heat load (approx. 1 h at least 400 ° C) reached


Description

Heat-resistant up to 800 °C.
Optimal film properties after first heat use. Will not peel or crack Quick-drying.
Excellent adhesion, excellent coverage and filling power. Conditional solvent resistance (temporary load) is applied after approx. 1 - 2 hours at 200 °C.
The optimal film properties and the full chemical and mechanical resilience are after the first heat load (approx. 1 h at least 400 ° C.