Feature

●Heat-resistant up to 800 °C.
●Optimal film properties after the first heat stress. Will not chip or crack. Quick-drying.
●Excellent adhesion, excellent coverage and filling power. A conditional solvent resistance (temporary load) is achieved after approx. 1 - 2 hours at 200 °C.
●IIII➤ The optimal film properties and the full chemical and mechanical resistance are determined after the first heat load (approx. 1 hour at least 400 °C).


Description

Heat resistant up to 800 °C.
Optimal film properties after first heat stress. Will not chip or crack. Quick drying
Excellent adhesion, excellent coverage and filling power. A conditional solvent resistance (temporary load) is achieved after approx. 1-2 hours at 200 °C.
The optimal film properties and the full chemical and mechanical resistance are determined after the first heat load (approx. 1 hour at least 400 °C).