Feature(may vary by option.)

●Contents: alloy tin 64% Bi35% Ag1%, Sloder Flux content: 10.5%
●Product parameters: total weight: 39g, net weight of paste: 30g
●Paste properties: no clean, strong viscosity, bright welding point, particle size: T5 (15-25 micron)
●Product advantages: pushing design for smoother flowing, no waste during welding
●Applications: widely used in circuit board, IC, telephone, TV and other household appliances and industrial equipment

[Sn64 & Bi35 & Ag]

Description

Wonderway Sn64/Bi35/Ag1 T5 Lead Free Solder Paste, Not Clean, 183℃ Melting Point (30g)