Feature(may vary by option.)

●Essmetuin Lead-free solder paste content: alloy tin 42% Bi 57.6% Ag0.4%, solder flux content: 10.8%
●Lead-free Solder Paste - Low temperature soldering paste with flux, melting point: 138℃, suitable for paper board or soft board that can not withstand high temperatures, special welding of small components.
●Product advantages: pushing type design, smoother flow, no wasting when welding
●Widely used in BGA/SMD circuit boards, motors, lighting, IC, TV and other household appliances and industrial equipment, sensors, wires, fuses, telephone, metal housing, motors, lighting, connectors, SMT maintenance
●The transparent residue is non-conductive, non-corrosive and highly insulated

[30 g]

Description

Essmetuin Sn42Bi57.6Ag0.4 138℃ Low Temperature Tin Paste Lead Free Solder Paste No-Clean Tin Paste Solder Flux Paste for PCB/IC/BGA/SMD Mobile Phone CPU Repair (30G)