The heart of the kit is a length of fast chip low temperature removal alloy. This alloy is like a solder that melts at temperatures well below those of normal solder (136 F) and remains liquid long enough to melt the existing solder, giving you time to carefully remove the component. Simply apply a generous amount of the included flux to the pins of the chip you want to remove, and then use a soldering iron with a flat tip to heat the pins while applying the low temperature alloy. The alloy remains liquid for a few seconds while coating all compounds. Once you have coated the pens, you should be able to lift the chip with tweezers or a hemostat. Clean the pads thoroughly and apply fresh solder and you are ready to solder a new part in place.