Lead Free / RoHS 3 Compliant / REACH Compliant Description Smooth FlowTM technology engineered with a lower density vehicle for better shear distribution and improved flow during heating Halogen free (EN14582 test method) Specifications: Alloy: Sn42/Bi. 57/Ag1 flux type: synthetic no-clean flux classification: ROL0 metal content: 86.75% metal by weight. Particle Size: T4 (20-38 micron), Melting Point: 137C (279F), Size: 3cc/10g Syringe Shelf Life: Cooled > 12 Months, Uncooled > 6 Months, Stencil Life: > 8 Hours at 20-50 % RH 22 % -28C (72-82F) > 4 hours at 50 hours at 50 °C 0% RH 2017 2-28 °C stencil cleaning, automated stencil cleaning systems for stencil and misprint boards. Manual cleaning with isopropyl alcohol (IPA) storage and handling in the fridge at 3-8°C. Do not freeze. Allow the solder paste to reach an operating temperature of 20-25 °C 4 hours before use. Transportation This product has no shipping restrictions. Shipping below 0°C or above 25°C for normal transportation times by ground or air will not affect the specified shelf life of the product.